Program | Technical Sessions | Schedule
program -> technical sessions
| Session A | HTS Applications Requirements |
| Topics | Cables, fault current limiters, transformers, rotating machineries, high-field magnets, etc. |
| Emphases | Speakers are asked to provide their list of top several wire characteristics that are essential for the specific application, and the logic for this priority. The speakers should provide the respective requirements for broad commercialization, as well as the bare requirements necessary for pre-commercial operation. |
| Session B | Challenges in Long Length Scale Up of High-Performance Coated Conductors |
| Topics | Substrates, HTS, CC, splices. |
| Emphases | Speakers are asked to address selected issues and suggest solutions. Issues include: CC/substrate/HTS performance and uniformity; CC throughput while maintaining high performance; CC reliability (mechanical, thermal, long-term); Splice as a means to increase CC length and their impact on performance. |
| Session C | Strategies Toward Low-Cost Coated Conductors |
| Topics | Substrates, HTS, CC, high-rate methods, quality control, yield. |
| Emphases | Speakers are asked to address selected issues and suggest solutions. Issues include: High-rate fabrication methods (substrate and HTS) that are amendable to scale up; Innovative approaches to CC cost reduction in the absence of mass production; Quality control to maximize CC throughput; Strategies to increase CC yield. |
| Session D | Effective Approaches to Enhance Coated Conductor Performance |
| Topics | Thick films, effectiveness of pinning centers, scalable methods to incorporate pinning centers, characterization techniques. |
| Emphases | Speakers are asked to address selected issues and suggest solutions. Issues include: Methods to produce thick films with minimum Jc reduction; Effectiveness of different pinning centers and their operative temperature-field-angle regimes; Suitability of various pinning strategies for different HTS methods (e.g. PLD, MOD, MOCVD, co-evaporation); Innovative and potentially scalable ways to incorporate effective pinning centers; Characterization methods (or a combination thereof) to determine CC performance in the most efficient and effective manner. |
| Session E | Posters on Innovative Ideas and Achievements |
| Topics | All, as outlined in other sessions. |
| Emphases | |
| Session F | Coated Conductor Properties beyond Critical Current |
| Topics | AC losses, stability, electromechanical properties, splices. |
| Emphases | Speakers are asked to address selected issues and suggest solutions. Issues include: Strategies to reduce AC losses in CC; Modeling and simulation of losses; Stability of CC with different stabilizers; CC architecture – AC loss – Stability inter-relationship; Losses in coils and systems; Electromechanical properties of CC and splices; Splice fabrication and performance (production splices, field joints, standards, thermal, long term). |
| Session G | Poster Summaries and Discussion |
| Logistics | Selected Poster presenters will summarize their Posters in 5-minute highlight talks. |
| Session H | Technical Round Table DiscussionsParticipants should attend one of the breakout discussions related to Session B, C, D or F to share thoughts and additional ideas resulting from the Workshop talks. A Moderator for each discussion group will then summarize the results and include them in the closing Technical Summary talks. |
| Session I | Summaries of Technical Sessions and Feedback from Applications Panelists |
| Logistics | Session chairs will summarize their technical sessions, with emphases on what issues are being addressed and what directions are being pursued on these issues. Panelists of Session A (Applications Requirements) will give their feedback and impressions in an open moderated discussion. |
